- Low glue requirement
- Benchtop unit with small footprint
- All applications, but features are limited to a maximum of 4 hose/head connections
- Intermittent nozzle application dot/bead/spray
- For your standard application in packaging and assembly
- With automatic heads or manually with hand guns
- e.g. tray closure, lid, wraparound, display, labeling, pallet securing etc.
- For packaging adhesives (EVA, PE, PO hot melt, PSA pressure sensitive hot melt adhesives)
- also for PA hotmelt up to 195 °C processing temperature
The innovative basic tabletop devices with intuitive operation guarantee maximum energy and material savings. Thanks to their compact dimensions, they can easily be placed on their own or mounted in mother machines.
Full control over the unit is provided by digital I/O interfaces as well as signaling contacts for the machine status for connection to the higher-level control system of the mother machine.
